The International Test Conference (ITC) is the world’s premier venue dedicated to the electronic test of devices, boards and systems—covering the complete cycle from design verification, design- for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement. Authors are invited to submit original, unpublished papers describing recent work in the field of testing and testable design. Of particular interest are works dedicated to the topics listed on the right and/or works focused on special tracks such as Automotive Reliability, Reliability of AI HW and usage of AI for Testing, 3D/2.5D and Chiplet Testing, or HW Security. Authors are also invited to submit practical, industry-oriented papers. A special industrial case-study track is dedicated to papers that enable others to learn best industrial practices. Submissions must include: • Title of paper. • Name, affiliation, e-mail address of each author. (Double blind review is not required). • The corresponding author(s). ITC will communicate with the corresponding author(s). • One or two topic(s) from the topic list, or a description of your topic. • An electronic copy of a complete paper of 6~10 pages for regular papers (including regular Industrial case-study papers) or 3~5 pages for short Industrial Practices papers. • An abstract of 35 words or less to be entered online.